Thermal Conductive Pad 3.0W
Thermal Conductive Pad 3.0W
Features: Thermal conductivity: 3.0 W/m-K Natural tacky Very soft & high compressibility Good Electrically isolating Easy to assembly Cost effective Applications: Computer services: CPU, Heat sink......
Contact Us
Product Description

Features

  • Thermal conductivity: 3.0 W/m-K
  • Natural tacky
  • Very soft & high compressibility
  • Good Electrically isolating
  • Easy to assembly
  • Cost effective

Applications

  • Computer services: CPU, Heat sink, Memory modules
  • LED Lighting, LCD-TV
  • Military Electronics
  • Power Supplies
  • Telecom services, Wireless instruments
  • Automotive control services

NQ-P-30XX Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

General performance

Product Model NQ-P-2030 Test Method
Colour Grey(Customizable) Visual
Main Ingredients silicone ***
Thickness(inch/mm) 0.3 to 10(mm) ASTM D751
Density (g/cc) 2.98 ASTM D297
Hardness (Shore 00)/(Shore C) 60/30 ASTM D2240
Tensile strength (psi) 32 ASTM D412
Operating Temperature(°F/℃) (-40 to 200℃) ***
Electrical properties
Breakdown voltage (V) >3000(Thickness≤0.5mm″) ASTM D149
>5000(Thickness≥0.5mm″)
Dielectric constant (1M HZ) 12.6 ASTM D150
Volume resistivity (Ohm.cm) 4.0 X 1013 ASTM D257
Thermal conductivity
Thermal conductivity(W/m-K) 3.0 ASTM D5470
Flame retardant OK

Standard Sheet Size     300*400mm

Advisory Message
Leave your needs and contact information,we will communicate with you in time
Contact Us