Performance and Characteristics
l Thermal conductivity: 12.00 W/m·K
l Gasket with extremely high ceramic filling amount (non-metallic)
l High thermal conductivity, high insulation, extremely high withstand voltage
l Low oil seepage rate, high reliability
l High compression and rebound resilience
l Soft and self-adhesive
l Easy to construct

The thermal conductive pad perfectly combines high thermal conductivity with conformability. It is specifically designed for solutions that utilize gaps to transfer heat. It can fill the gaps and effectively transfer the heat from the heat-generating parts to the heat sink. These materials adhere to the mating surfaces with extremely low pressure, thus generating little or no stress on the mating components.

The thermal conductive pad has inherent adhesive properties and does not require an adhesive layer. At the same time, it covers the microscopically uneven surface, enabling the mating components to make full contact and thus improving the thermal conduction efficiency. The thickness of the product can be customized according to customers’ requirements. In addition, you can choose to have an adhesive backing or single-sided stickiness, which makes it convenient to use.

Typical Applications

Desktop computers, laptops and servers

Laser devices

Power supplies and UPS (Uninterruptible Power Supplies)

Electronic communication devices

Military electronic products

Motor and engine controllers

Energy conversion devices

Signal converters

Mass storage devices

Vibration Damping Applications

General performance

he standard size is 300×400 mm and it can be cut according to customers’ requirements.
lThe thickness can be selected from 0 to 3.0 mm.
lAdhesive backing can be provided according to the needs.