- Product Introduction
NQ-958-30 is a single-component room-temperature-curing silicone sealant. This product has excellent thermal conductivity, and its general operating temperature range is from -60°C to 200°C. During the curing process, alcohol substances are released, which have no corrosion effect on materials such as polycarbonate (PC) and copper, and it fully complies with the requirements of the EU RoHS and REACH Directives.
- Product Applications
Fixing, thermal conducting, insulating, shockproofing, and moisture-proof sealing for electronic and electrical components. - Usage Process and Precautions
- Clean the surface: Thoroughly clean the surface of the object to be bonded or coated, and remove rust, dust, oil stains, etc.
- Apply the adhesive: Unscrew (or cut open) the cap of the adhesive tube, and squeeze the adhesive onto the cleaned surface to make it evenly distributed.
- Curing: Place the bonded or sealed component in the air and let it cure naturally. The curing process is a process that starts from the surface and proceeds to the inside. If the position where the adhesive is applied is relatively deep, especially in the parts that are not easily exposed to air, the complete curing time will be extended. If the temperature is low, the curing time will also be extended.
- After applying the adhesive, immediately tighten the cap of the unused adhesive and store it in a sealed manner. When using it again, if there is a little skin formation at the seal, just remove it, which will not affect normal use. During the storage of the adhesive, a small amount of curing may also occur at the tube opening. After removing it, the adhesive can be used normally without affecting the product performance.
4.Technical Parameters
Before Curing
- Appearance: White Paste-like
- Surface Drying Time (min): ≤15
- Complete Curing Time (d): 3 to 7
After Curing
- Relative Density (g/cm³): 3.00 to 3.30
- Hardness (Shore A): 65 to 80
- Tensile Strength (MPa): ≥1.0
- Shear Strength (MPa): ≥0.6
- Elongation at Break (%): ≥20
- Temperature Resistance Range (℃): -60 to 200
- Volume Resistivity (Ω·cm): ≥1.0×10¹²
- Dielectric Strength (kV/mm): ≥13
- Thermal Conductivity [W/(m·K)]: ≥3.0
Note: The mechanical property and electrical property data were measured at 25°C, with a relative humidity of 55%, and 7 days after solidification.
5. Packaging Specifications
300ml per tube, 2600ml per tube.
6. Storage and Transportation
Store in a cool and dry environment below 25°C for 6 months. Products beyond the shelf life should be confirmed to be free of abnormalities before use.
This type of product is a non-dangerous good and can be transported as general chemicals. Be careful to avoid leakage during transportation.
Thermal conductive sealant is mainly used in high-power heat-dissipating electronic products that require heat dissipation, such as MOS, heat sinks, laser chips, etc. The thermal conductive sealant can not only dissipate heat but also bond.
