I. Product Features and Applications
NQ-2589-08
NQ-2589-08 is a two-component addition-type thermally conductive potting adhesive with medium viscosity. It cures upon heating and has the characteristic that the higher the temperature, the faster the curing. This product does not generate any by-products during the curing reaction. It can be applied to the surfaces of materials such as PC (Poly-carbonate), PP, ABS, PVC, etc., and metals. It can be used in an environment ranging from -40°C to 200°C. It fully complies with the requirements of the EU ROHS and REACH directives.
II. Typical Uses
Potting, heat dissipation and protection of power modules
Potting, heat dissipation and protection of other electronic components
Potting and protection of automotive electronic modules
Potting, heat dissipation and protection of power modules
Potting, heat dissipation and protection of other electronic components
Potting and protection of automotive electronic modules
III. Technical Parameters
Performance Indicators Component A Component B Inspection Standard
Before Curing Appearance Grey fluid White fluid Q/NQ 1-2016
Viscosity (cps) 3000～4000 3000～4000 GB/T 10247
Mixing Ratio A:B (by weight) 1∶1 Q/NQ 1-2016
Viscosity after Mixing (cps) 5000-7000 GB/T 10247
Applicable Time at Room Temperature (min) 60-90 Q/NQ 1-2016
Molding Time at Room Temperature (h) 4-6 GB/T 531.2
Viscosity (cps) 3000～4000 3000～4000 GB/T 10247
Mixing Ratio A:B (by weight) 1∶1 Q/NQ 1-2016
Viscosity after Mixing (cps) 5000-7000 GB/T 10247
Applicable Time at Room Temperature (min) 60-90 Q/NQ 1-2016
Molding Time at Room Temperature (h) 4-6 GB/T 531.2
After Curing Hardness (shore A) at 100℃/120min 60 GB/T 531.2
Thermal Conductivity (W/m·k) ≥0.8 ASTM D5470
Dielectric Strength (KV/mm) ≥17 GB/T 1695
Dielectric Constant (1.0MHz) 2.5-3.3 GB/T 1694
Volume Resistivity (Ω·cm) ≥1.0×10¹³ GB/T 1692
Specific Gravity 1.68±0.1 GB/T 13354
The above performance data before curing were all measured under the room temperature conditions of the products produced on the same day. The mechanical and electrical performance data were all measured after the samples were completely cured. Our company does not assume relevant responsibilities for the differences in data caused by different test conditions or product improvements.
IV. Usage Process
Thermal Conductivity (W/m·k) ≥0.8 ASTM D5470
Dielectric Strength (KV/mm) ≥17 GB/T 1695
Dielectric Constant (1.0MHz) 2.5-3.3 GB/T 1694
Volume Resistivity (Ω·cm) ≥1.0×10¹³ GB/T 1692
Specific Gravity 1.68±0.1 GB/T 13354
The above performance data before curing were all measured under the room temperature conditions of the products produced on the same day. The mechanical and electrical performance data were all measured after the samples were completely cured. Our company does not assume relevant responsibilities for the differences in data caused by different test conditions or product improvements.
IV. Usage Process
- Before Mixing: First, thoroughly stir Component A and Component B evenly in their respective containers.
- During Mixing: The weight ratio of Component A: Component B = 1:1 should be observed, and stir evenly.
- Degassing: The mixed adhesive should be degassed under vacuum for 1-3 minutes.
- Potting: The well-mixed adhesive should be poured into the product to be potted as soon as possible to avoid the thickening of the adhesive and poor fluidity at a later stage.
- Curing: Both room temperature curing and heating curing are acceptable. It is recommended to cure at 100°C for 30 minutes by heating.
V. Precautions
- The adhesive should be stored sealed in a dry room temperature environment. The well-mixed adhesive should be used up as soon as possible to avoid waste.
- This product is a non-dangerous product, but do not let it enter the mouth or eyes.
- This product is non-toxic, has good physiological inertia, and does not irritate or harm the skin. The product does not contain flammable and explosive components, will not cause fire or explosion accidents, and has no special requirements for transportation.
- After being stored for a period of time, the adhesive will be stratified to some extent. Please stir it evenly before use, which will not affect the performance.
- The following substances may hinder the curing of this product or cause non-curing phenomena. Therefore, it is best to apply it after a simple experimental verification, and the application site needs to be cleaned if necessary.
a. Incompletely cured condensation-type silicone rubber. b. Amine-cured epoxy resin.
c. White wax welding joints or rosin solder joints.
VI. Packaging Specifications, Storage and Transportation
- Component A: 25kg/drum; Component B: 25kg/drum.
- The storage period of this product is 360 days (below 25°C). Products exceeding the storage period should be confirmed to be free of abnormalities before use.
- This type of product is a non-dangerous product and can be transported as general chemicals.
VII. Suggestions and Statements
It is recommended that users conduct an applicability test before officially using this product. Due to the diversity of actual applications, our company does not guarantee the problems that may occur when using our products under specific conditions and does not assume any responsibility for direct, indirect or accidental losses. If users encounter any problems during the use process, they can contact our company’s after-sales service department, and we will do our best to provide assistance.
It is recommended that users conduct an applicability test before officially using this product. Due to the diversity of actual applications, our company does not guarantee the problems that may occur when using our products under specific conditions and does not assume any responsibility for direct, indirect or accidental losses. If users encounter any problems during the use process, they can contact our company’s after-sales service department, and we will do our best to provide assistance.
