Elevate MOS & Radiator Performance with Boron Nitride & Spherical Alumina Technology

In high-performance electronic systems, overheating of MOSFETs and radiators often leads to degraded performance, shortened lifespan, and even catastrophic failures. Our  Thermal Silicone Pad combines two advanced thermal fillers—Boron Nitride and Spherical Alumina—to create a revolutionary heat dissipation solution that breaks through thermal barriers, ensuring optimal operation for your critical components.

The radiator is filled for heat dissipation.

Dual-Filler Technology: Redefining Thermal Conductivity

Boron Nitride (BN): The Insulating Thermal Conductor

• Exceptional Thermal Performance: Boasts a high intrinsic thermal conductivity of 300 W/(m·K), rapidly transferring peak heat from MOS devices vertically.
• Electrical Safety Assurance: With a low dielectric constant (≈4), it prevents leakage currents, making it ideal for high-voltage applications.
• Nanoscale Thermal Network: Its layered structure forms a
  Efficient Heat Conduction Network，minimizing thermal resistance in the silicone matrix.

Spherical Alumina (Al₂O₃): The Path Optimizer

• Perfect Spherical Geometry(Roundness >98%): Creates a low-contact-resistance “thermal highway” within the pad, reducing thermal impedance by 40% compared to traditional thermal greases.
• Precision Particle Size(D50=15μm): Achieves 30% higher filler loading without compromising flexibility, ensuring seamless surface adaptation.
• Thermal Compatibility: Low coefficient of thermal expansion (6.8×10⁻⁶/℃) matches PCB substrates, resisting structural damage from thermal cycling.

Synergistic Effect: Together, these fillers deliver a >3.0W/(m·K) thermal conductivity, enabling enhance Radiator Efficiency 60% and maintaining component temperatures within safe operating ranges.

Multi-Functional Advantages for Demanding Applications

1. Ultra-Efficient Heat Dissipation

• Eliminates hotspots in MOSFET/IGBT modules, preventing thermal runaway and extending device life.
• Enables 50W/cm² high heat flux dissipation in thin-profile radiators (6mm thickness), critical for compact electronic designs.

2. Universal Surface Adaptation

• Soft & Flexible(50 Shore A): Conforms to uneven surfaces, filling air gaps and enhancing thermal contact even in complex geometries.
• Vibration Resistance: Absorbs mechanical shocks, protecting solder joints from stress-induced failures in high-vibration environments.

3. Extreme Environmental Reliability

• Wide Temperature Range: Operates stably from -40°C to 200°C, suitable for harsh industrial and automotive applications.
• Long-Lasting Performance: Passes 1000-hour HTOL testing with <5% thermal degradation and <10% compression set (100kPa/24h), ensuring 5+ years of reliable service.

4. Easy Installation & Compliance

• Customizable Thickness: Available in 500μm–5mm sheets, easily die-cut into any shape (minimum aperture 0.3mm).
• RoHS 2.0/REACH Compliant: Low-volatility, V0-grade flame-retardant formula prevents PCBA contamination.

Target Applications

Ideal for industries requiring precision thermal management:

• Power Electronics: MOSFET/IGBT modules, power supplies, and inverters.
• New Energy Vehicles: OBC controllers, motor drivers
• Consumer Electronics: Laptops, gaming consoles, and high-performance GPUs.
• Industrial Control: PLCs, robotics, and 24/7 operating equipment.
• Telecom & Networking: Base stations, routers, and server racks.

Technical Specifications at a Glance

Unlock Your Thermal Potential Today

Whether you’re designing next-gen electric vehicles, high-density server farms, or compact consumer devices, our thermal silicone pad bridges the gap between component performance and thermal management.

Contact Us Now for:
✅ Free thermal resistance testing report
✅ Fast sample prototyping
✅ Customized thermal solutions by our engineering team

Don’t let heat limit your designs. Let Boron Nitride and Spherical Alumina work together to shatter thermal barriers and unleash the full potential of your MOS and radiator systems.